Semiconductor Device Fabrication Lab

Prof. Andrew Sarangan
University of Dayton
sarangan@udayton.edu
(937) 229-3190

Vapor Priming and Image Reversal

This vacuum oven is used for HMDS vapor priming of silicon wafers for improving their survivability during wet processing. Maximum temperature is 150C. It is also used for ammonia image reversal (IR) of positive photoresists.