Photonics, Electronics, Optical Coatings
Prof. Andrew SaranganUniversity of Daytonsarangan@udayton.edu(937) 229-3190
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This is a ICP/RIE etch tool used for a large number of etch processes, including Si, SiO2, Si3N4, Ge, etc… Fluorinated and hydrogenated gases are used. Current processes inculde SF6, CF4, C4F8, H2, CH4, Ar and O2.