Semiconductor Device Fabrication Lab

Photonics, Electronics, Optical Coatings

Prof. Andrew Sarangan
University of Dayton
(937) 229-3190

Yield Engineering System 3TA

This vacuum oven is used for HMDS vapor priming of silicon wafers for improving their survivability during wet processing. Maximum temperature is 150C. It is also used for ammonia image reversal (IR) of positive photoresists.